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Flexible printed circuit board "High Flex FPC" [Over 10 million bending cycles]

A flexible circuit board that achieved over 10 million bending characteristics at 70℃! It is flexible and excels in bending performance even in high-temperature environments, ensuring high reliability!

The "High Flex FPC" is a flexible printed circuit board (FPC) with bending characteristics that exceed 10 million cycles at 70°C. By using a high Tg (glass transition temperature) coverlay, it suppresses the degradation of bending characteristics at high temperatures. It is flexible and excels in bending performance even in high-temperature environments, offering high reliability. 【Features】 ■ Significantly improved bending characteristics by using rolled copper foil ■ Capable of high-speed transmission of over Gbps with low loss ■ Easy to match characteristic impedance  ・Characteristic impedance value can be matched at differential 100±15Ω *For more details, please request materials or view the PDF data from the download.

  • Printed Circuit Board

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